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TitleElectric Drive Technologies
LanguageEnglish
File Size27.7 MB
Total Pages347
Table of Contents
                            ACRONYMS AND ABBREVIATIONS
I. INTRODUCTION
	1.1. Accomplishments
		1.1.A. Ribbon Electrical Interconnects Demonstrate Reliability to Enable Increased Current Density in Power Electronics
			Ribbon electrical interconnects of different geometries were subjected to various forms of accelerated testing and exhibited good reliability.
		1.1.B. Thermal Stackup Enables Full Potential of WBG Devices
			Providing materials science and engineering to support the advancement and maturation of alternative interconnect technologies for next-generation power electronic devices.
		1.1.C. Integrated WBG Onboard Charger and dc-dc Converter: Double Power Density at Half the Cost
			A novel integrated charger architecture and control strategy with WBG devices reduces component count by 47%, dc bus capacitance by 60%, and losses by 55%.
		1.1.D. Next Generation Inverter Approaches DOE 2020 Goals
			Developed, tested, and demonstrated a scalable and highly efficient inverter that meets the DOE 2020 power density targets and is projected to meet DOE 2020 cost target at scaled up power level.
	1.2. Small Business Innovative Research Grants
II. RESEARCH AREAS
2.0 Electric Motor Research and Development
	2.1. Non-Rare Earth Motor Development
	2.2. Multi-Speed-Range Electric Motors
	2.3. Alternative High-Performance Motors with Non-Rare Earth Materials
	2.4. Unique Lanthanide-Free Motor Construction
	2.5. Brushless and Permanent Magnet Free Wound Field Synchronous Motors for EV Traction
	2.6. Electric Motor Thermal Management R&D
	2.7. Development of Radically Enhanced alnico Magnets (DREaM) for Traction Drive Motors
3.0 Power Electronics Research and Development
	3.1. Inverter R&D
	3.2. Innovative Technologies for Converters and Chargers
	3.3. Traction Drive Systems with Integrated Wireless Charging
	3.4. Gate Driver Optimization for WBG Applications
	3.5. Power Electronics Thermal Management R&D
	3.6. High Temperature DC Bus Capacitor Cost Reduction & Performance Improvements
	3.7. Advanced Low-Cost SiC and GaN Wide Bandgap Inverters for Under-the-Hood Electric Vehicle Traction Drives
	3.8. 88 Kilowatt Automotive Inverter with New 900 Volt Silicon Carbide Mosfet Technology
	3.9. High-Efficiency High-Density GaN-Based 6.6kW Bidirectional On-board Charger for PEVs
	3.10. Cost-Effective Fabrication of High-Temperature Ceramic Capacitors for Power Inverters
	3.11. High Performance DC Bus Film Capacitor
	3.12. A Disruptive Approach to Electric Vehicle Power Electronics
	3.13. Next Generation Inverter
4.0 Benchmarking, Testing, and Analysis
	4.1. Benchmarking EVs and HEVs
	4.2. Thermal Performance Benchmarking
	4.3. 2015: Continued Analysis of the xEV Traction Drive Electric Motor & PE Supply Chain in North America
5.0 Advanced Packaging Research and Development
	5.1. Power Electronics Packaging
	5.2. Performance and Reliability of Bonded Interfaces for High-Temperature Packaging
6.0 Materials Research and Development
	6.1. Power Electronics and Electric Motor Materials Support (Joint with VTO Propulsion Materials)
                        
Document Text Contents
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FY 2015 Annual Progress Report 151 Electric Drive Technologies

power modules shown in Figure 3-62 are representative of a typical power module design (e.g., they are not
commercially-available modules). The materials used for this analysis are shown in Table 3-4.

Table 3-4: Materials used for the module show in Figure 3-62





Layer

SiC (device)

Solder

Cu

SiN (substrate)

Cu

Solder

AlSiC (baseplate)

Figure 3-63: Specific thermal resistance plotted versus the convective thermal resistance for different DBC-to-die edge offset
values.

Figure 3-63 plots the total thermal resistance versus the convective thermal resistance for the direct-cooled
DBC configuration. Various curves corresponding to different DBC-to-die distances (a) are shown in the
figure. As shown, the effect of increasing the DBC size (dimension "a" in Figure 3-62) depends on the
convective cooling performance. The heat spreading effects of a larger DBC size are more beneficial at higher
convective thermal resistance values (e.g., air cooling).

Direct
cooled

DBC
Direct
cooled
Baseplate

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FY 2015 Annual Progress Report 152 Electric Drive Technologies

Figure 3-64 plots the total thermal resistance versus the convective thermal resistance for two direct-cooled
baseplate configurations. In Figure 3-64, the effect of varying the baseplate-to-DBC distance ("b" dimension in
Figure 3-62) on the total thermal resistance is evaluated. Two die-to-DBC offset values were considered: 3.5
mm (left plot in Figure 3-64) and 7.5 mm (right plot in Figure 3-64). Similar to the direct-cooled DBC
configuration, the effect of changing the baseplate-to-DBC size ("b" dimension in Figure 3-62) depends on the
convective thermal resistance. The benefits of increasing the baseplate-to-DBC size on the total thermal
resistance are minimal at lower convective thermal resistance values. At higher convective resistances varying
the baseplate-to-DBC offset value has more of an impact on the total thermal resistance for the case with the
smaller (3.5 mm) die-to-DBC distance.









Figure 3-64: Specific thermal resistance plotted versus the convective thermal resistance for different baseplate-to-DBC edge
offset values. The plot on the left uses a 3.5 mm die-to-DBC distance, and the plot on the right uses a 7.5 mm die-to-DBC
distance.

Figure 3-65: Specific thermal resistance plotted versus the convective thermal resistance for DBC- and baseplate-cooled
configurations.

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FY 2015 Annual Progress Report 324 Electric Drive Technologies

toward (1) how to improve the thermal transfer perpendicular to the wires and (2) understanding thermal
property variability in the context of wire diameter.

FY 2015 Presentations/Publications/Patents

1. A. A. Wereszczak, Z. Liang, M. K. Ferber, and L. D. Marlino, “Uniqueness and challenges of
sintered silver as a bonded interface material,” Journal of Microelectronics and Electronic
Packaging 11,158–165 (2014).

2. A. A. Wereszczak, S. B. Waters, and W. Carty, “Transfer Method for Printed Sinterable Paste
Having Nonaqueous Solvent,” Invention Disclosure Number 201503508, DOE S-138,140, April 4,
2015.

3. A. A. Wereszczak, and W. Carty, “Drying Method for Sinterable Paste Used for Bonded Joints,”
Invention Disclosure Number 201503507, DOE S-138,139, April 3, 2015.

4. A. A. Wereszczak, Z. Liang, and T. A. Burress, “Enabling materials for high-temperature power
electronics,” presented at the 2015 VTO AMR, Arlington, Virginia, June 10, 2015.

5. A. A. Wereszczak, S. B. Waters, M. Modugno, D. J. DeVoto, and P. P. Paret, “Method to determine
maximum allowable sinterable silver interconnect size,” in preparation, 2015.

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FY 2015 Annual Progress Report 325 Electric Drive Technologies

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